Advanced Packaging Engineer

Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and develop roadmaps for the company.

The role involves:

1. Developing 2.5 / 3D advanced packaging solutions .
2. Collaborating with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability.
3. Managing the internal packaging team and driving overall package development within the company.

This position can be worked remotely.

Requirements include:

• Strong experience and knowledge in semiconductor packaging.
• Expertise in 2.5 / 3D advanced packaging solutions.
• Excellent communication skills and team management abilities.
• Previous experience liaising with OSATs.
• Degree qualification.

Please contact Rachel Anderson for further details.