SiC Process Engineering - Wafer Laser Splitting & Grinding M/F

SiC Process Engineering - Wafer Laser Splitting & Grinding M/F

In this role you will contribute to the SiC technology ramp-up at ST in a new mass-production fab in Catania, driving efficient finishing processes for SiC substrates. You will collaborate with the Sweden center and internal teams to define flows, recipes, and qualification plans, ensuring robustness as operations scale. The position combines hands‑on process work with troubleshooting, tool qualification, and cross‑functional collaboration to deliver high‑quality, manufacturable processes. This is an opportunity to shape the production ramp and enable mass production of next‑generation SiC technology. DEI initiatives equal opportunities employee resource groups Hands‑on work with Laser Splitting and wafer Surface Grinding processes Systematic troubleshooting of equipment‑related problems Implement and refine qualification plans for new on‑line processes Qualify new production tools with external suppliers and internal criteria Collaborate with equipment engineers to understand interactions and operating limits Train new operators, technicians and engineers Support R&D projects and contribute to yield and industrialization Produce and present reports to management and technical committees PhD or Master in engineering/physics/material science/chemistry Experience in silicon processing is a plus In this role you will contribute to the SiC technology ramp‑up at ST in a new mass‑production fab in Catania, driving efficient finishing pr...

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